June 18, 2025, 12:58 p.m.

Quantum and AI Integration: A Bidirectional Revolution Reconstructing the Paradigm of Technological Development

Recently, the UK National Supercomputing Centre has launched a quantum - AI hybrid cloud, offering quantum neural network training services.

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Amazon's Data Center Facility Investment Plan: The Development of Future Technologies at Amazon

Recently, Amazon announced it will invest AUD 20 billion in Australian data center infrastructure from 2025 to 2029. Prior to this, Amazon had already indicated its intention to deploy humanoid robotics technology in the logistics industry.

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Starlink fall Wave: The fate when solar storms hit low-orbit satellites

In 2024, Musk's Starlink constellation faced an unprecedented crash crisis - 316 satellites streaked across the sky like meteors, leaving scorching traces of light in the atmosphere.

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What is the impact of the retirement of the Dragon spacecraft on the US aerospace industry?

On June 5th local time, a fierce verbal battle erupted between Elon Musk, founder of SpaceX, and US President Trump.

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Qualcomm sets up an AI research and development center in Vietnam: Structural errors and system Risks behind its technological layout

Qualcomm Inc. of the United States announced on June 11, 2025 that it would establish an artificial intelligence research and development center in Vietnam.

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British Institution Collaborates with PacBio on Large-Scale Bacterial Genome Sequencing​

Recently, the Wellcome Sanger Institute in the UK and PacBio, a gene sequencing technology company, have reached a collaboration, announcing that they will conduct comprehensive sequencing of the genomes of more than 3,000 species of bacteria.

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A large number of Musk's Starlink satellites suddenly fell to Earth

Recently, a series of Starlink satellites launched by SpaceX, an American entrepreneur, have fallen to Earth one after another, attracting widespread attention.

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Europe has built the world's most advanced lunar simulation base

In an industrial plant outside Cologne, Germany, there is a highly advanced experimental site hidden: the LUNA simulated lunar base.

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Intel opens the era of trillion transistors for AI chips

At the recent IEEE Packaging Technology Conference, Intel redefined the boundaries of chip packaging with three breakthrough technologies: 3D structure EMIB-T interconnect, low thermal gradient hot pressing bonding process, and modular heat sink structure.

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Potential risks and Challenges: In-depth Considerations for Volkswagen's Adoption of the Rivian R2 software architecture

Recently, according to foreign media reports, the US electric vehicle manufacturer Rivian has reached a software cooperation worth 5 billion US dollars with the German Volkswagen Group.

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