拜登(Joe Biden)政府本周启动规模530亿美元的《芯片法案》(Chips Act)计划，这项计划将考验美国政府能否扭转国内半导体行业的外流趋势。
美国商务部长吉娜·雷蒙多(Gina Raimondo)将在周四公布拜登政府计划如何发放芯片制造补贴，随后将在下周公布更多关于公司如何申请这些补贴的细节。
这是美国政府的一项大手笔公共投资：其中大约390亿美元用于晶圆厂以及材料和设备工厂的制造补贴，还有132亿美元用于研发和劳动力培训。
除此之外还有一项税务激励计划，为制造和加工设备提供25%的先进制造业投资税收抵免。
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